Thermomechanical behavior of micron scale solder joints under dynamic loads
نویسندگان
چکیده
منابع مشابه
Thermomechanical behavior of micron scale solder joints under dynamic loads
Recent trends in reliability and fatigue life analysis of electronic devices have involved developing structural integrity models for predicting the operating lifetime under vibratory and thermal environmental exposure. Solder joint reliability is the most critical issue for the structural integrity of surface mounted electronics. Extensive research has been done on thermal behavior of solder j...
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ژورنال
عنوان ژورنال: Mechanics of Materials
سال: 2000
ISSN: 0167-6636
DOI: 10.1016/s0167-6636(99)00053-8